Tom's Hardware · Semiconductors· Anton Shilov ·· 5 天前AI 评分58
GlobalFoundries 高管详解 FDX Fusion：无需 EUV 实现 7nm 级性能，目标 2030 年量产
GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow
AI 导读
GlobalFoundries FD-SOI 业务部门副总裁 Sudipto Bose 在采访中详解 FDX Fusion 工艺，称其基于平面晶体管和 DUV 光刻实现 8nm 级逻辑密度（1400 万门/平方毫米）与 7nm 级功耗性能，无需 EUV。
来源：Tom's Hardware · Semiconductors · tomshardware.com