EE Times· Aaron Fellis, corporate vice president and general manager, Wet Equipment Technology Systems, Lam Research·· 16 天前AI 评分40
AI 封装挑战：面板级工艺加速崛起的 5 个原因
The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum
AI 导读
AI 推动芯片封装突破传统晶圆尺寸限制，面板级工艺正成为未来十年先进封装规模化的关键路径。Lam Research 正在参与推动这一方向。
来源：EE Times · eetimes.com